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Heat dissipation material Product List and Ranking from 10 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Heat dissipation material Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. コスモ石油ルブリカンツ Tokyo//Chemical
  2. ゼオン化成 高機能材料部 Tokyo//Other manufacturing
  3. ニューメタルス　エンド　ケミカルス　コーポレーション Tokyo//Resin/Plastic
  4. 4 プランゼージャパン Tokyo//Ferrous/Non-ferrous metals
  5. 5 日本旭立科技 Osaka//Resin/Plastic
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Heat dissipation material Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Thermal Interface Material (TIM) ゼオン化成 高機能材料部
  2. Silicone-free high-performance thermal conductive material * Thermal design column and comparison test data available. コスモ石油ルブリカンツ
  3. Insulating heat dissipation material "Boron Nitride Nanotubes (BNNT)" ニューメタルス　エンド　ケミカルス　コーポレーション
  4. High-performance heat dissipation material for electronic devices コスモ石油ルブリカンツ
  5. 4 Copper Molybdenum, Copper Tungsten Heat Dissipation Material - Low Thermal Expansion, High Thermal Conductivity プランゼージャパン

Heat dissipation material Product List

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Silicone-free high-performance thermal conductive material * Thermal design column and comparison test data available.

Silicone-free high-performance thermal conductive material * Thermal design column and comparison test data available.

Adopted by the supercomputer "Fugaku"! Reducing electrical contact failures! Introducing a silicone-free, high-performance thermal interface material that does not generate low molecular weight siloxanes!

"Cosmo Thermal Grease" and "Cosmo Thermal Gap Filler" are high-performance thermal materials with excellent heat resistance and high thermal conductivity. Since they do not use silicone-based materials, there is no concern about contact failure due to low molecular siloxane. Please choose between grease and gap filler (hardened type) according to your application. "Cosmo Thermal Grease" is a non-silicone thermal material that can be spread thinly up to several tens of micrometers, reducing thermal resistance. It is used in many fields, including computer CPUs, wireless base stations, office multifunction devices, car navigation systems, and home appliances. "Cosmo Thermal Gap Filler" is a hardened thermal paste. It can be controlled to any thickness, resulting in less stress on components. You can choose between a one-component heat-curing type and a two-component room-temperature curing type. ★ You can download test data comparing thermal effects. ★ You can also download the "Thermal Design Column" written by Naoki Kunimine, the representative director of Thermal Design Lab. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts

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Insulating heat dissipation material "Boron Nitride Nanotubes (BNNT)"

Insulating heat dissipation material "Boron Nitride Nanotubes (BNNT)"

A compound material that excels in heat resistance and flame retardancy, and possesses electrical insulation properties. It can enhance the strength of resin products and impart characteristics such as flame retardancy and corrosion resistance.

"Boronnitride Nanotubes (BNNT)" are insulating heat-dissipating materials that have the same structure as carbon nanotubes (CNT). They are chemically stable and exhibit excellent heat resistance and flame retardancy. Additionally, we uniquely supply "BN NanoBarbs," which are boron nitride nanotubes wrapped in hexagonal boron nitride (h-BN). As application products, we offer masterbatches compounded with plastics and master alloys dispersed in metals such as aluminum and copper. Improvements in tensile strength and other properties can be observed with an addition of just a fraction of a percent. [Features] - Chemically stable - Excellent heat resistance - Excellent flame retardancy - High strength - High thermal conductivity *For more details, please download the PDF or feel free to contact us.

  • Other polymer materials

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[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)

[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)

【Available for preview】~ Substrate, Joining, Sealing, Cooling Technologies ~

Book Title: Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Management －－－－－－－－－－－－－－－－－－－－－ ◎ Thorough explanation of Si, SiC, GaN, gallium oxide, required characteristics in automotive environments, and implementation examples! ◎ Detailed design guidelines for TIMs and heat dissipation sheets that balance "thermal characteristics" and "operational reliability"! －－－－－－－－－－－－－－－－－－－－－ ■ This book includes the following information: - Improvement of resin heat resistance and measures against material expansion - Composite materials of thermally conductive fillers and resins - Development trends of resin substrates, ceramic substrates, and metal substrate materials - Countermeasures for warping, delamination, and breakage caused by inter-material stress due to linear expansion coefficients - Support for high-temperature operation above 300°C and low-temperature operation below freezing - Balancing thermal conductivity, mechanical properties, electrical insulation properties, and strength reliability - Improvement of thermal fatigue characteristics against repeated stress due to heat resistance and differences in linear expansion, and crack prevention - Suppression of electromigration and electrochemical migration - Ensuring moisture resistance, oxidation resistance, heat resistance, and long-term reliability of metal sintered materials

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[Technical Data Presentation] Heat Dissipation Material for EV Onboard Lithium-Ion Batteries

[Technical Data Presentation] Heat Dissipation Material for EV Onboard Lithium-Ion Batteries

Heat dissipation by sandwiching in a lithium battery pack (cell)! Contributing to solving customer problems with pressing technology.

The "HEAT SINK" is a heat dissipation material for automotive lithium-ion batteries. The material is C1020R-H, and it dissipates heat by being sandwiched between lithium battery packs (cells). Additionally, the EV cells produced by Kōkōgyō using this product have a compact sheet shape of 261×216mm while possessing a large volume. 【Features】 ■ Fully automated production line from material input to pressing and packaging ■ Minimizes contamination without human touch ■ Pre-processing uses dry oil to eliminate residual oil during the drying process ■ EV cells: Achieve excellent heat dissipation and high energy density ■ Modules: Compact shape enhances vehicle mounting efficiency *For more details, please refer to the PDF document or feel free to contact us.

  • Press Dies
  • Processing Contract
  • Secondary Cells/Batteries

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Insulation and Heat Dissipation Material "Tran-Q Clay"

Insulation and Heat Dissipation Material "Tran-Q Clay"

Soft, low-adhesion, stretchable! High degree of deformation freedom, capable of filling three-dimensional shapes, curved surfaces, and complex spaces!

"Tran-Q Clay" is a highly insulating and thermally conductive material that can be freely molded, handled by our company, NOK Corporation. It can be used around electrical circuits and electronic components. It does not flow at room temperature and does not pump out at high temperatures. Additionally, it does not dirty the process or the installation area. [Features] ■ Freely moldable ■ Soft, clay-like texture ■ Low adhesion, excellent handling and reworkability ■ Electrically insulating *For more details, please refer to the PDF document or feel free to contact us.

  • Other consumables

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Thermal management and heat dissipation materials for 5G communication devices.

Thermal management and heat dissipation materials for 5G communication devices.

Investigation Report on Thermal Management and Heat Dissipation Materials for 5G Communication Equipment: Trends in Electronic Patent Technology

You can view patent information categorized by the following technologies: - High-frequency circuit boards - TIM (Thermal Interface Material) - Antenna modules - Optical communication - Vehicle communication - Vapor chambers

  • Other semiconductors

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Advantages of non-silicone thermal interface materials

Advantages of non-silicone thermal interface materials

Prevention of contact failure using low molecular weight siloxane!

In relays and switches used in electronic components, contact failure due to low molecular weight siloxanes is a concern. It is said that contact failure caused by low molecular weight siloxanes occurs when unreacted components or degradation products in silicone-based materials gasify and adhere to the relay contacts, and then oxidatively decompose into silicon dioxide (SiO2) due to the energy during relay operation, leading to accumulation. In recent years, as electronic components have become smaller and lighter, the volume of packaging has been decreasing, which has increased the risk of contact failure due to rising gas concentrations. Cosmo's thermal insulation materials do not contain silicone-based substrates, so there is no concern about contact failure due to low molecular weight siloxanes. They can be safely used in compact and high-density mounted electronic components. [Causes of electrical contact failure] - Dust in the air - Corrosion (sulfidation) on silver contacts - High concentration vapors of organic compounds - Vapors in silicone products (low molecular weight siloxanes)

  • Lubricants

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[Series Volume 4] Thermal Design Consultant Naoki Kunimine's Column

[Series Volume 4] Thermal Design Consultant Naoki Kunimine's Column

<Currently available for free> From my position, having been involved in thermal design for many years, I would like to share my thoughts on thermal design.

Written by Mr. Naoki Kunimine, President of Thermal Design Lab Inc. This is a column material reflecting on 45 years of involvement in thermal design, titled "Miscellaneous Stories of Thermal Design." Due to the positive feedback from readers, we are releasing the fourth installment of the column. 【Content (Excerpt)】 The author first heard the term "thermal design" over 40 years ago. In the fourth installment, I will share my views on the "true goal" of utilizing thermal fluid simulation. ■ How to eliminate individual differences in analysis modeling ■ How to improve the accuracy of input data for analysis ■ The goal of simulation is not "agreement with actual measurements" *For more details, please refer to the PDF material or feel free to contact us.

  • Other electronic parts

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Copper Molybdenum, Copper Tungsten Heat Dissipation Material - Low Thermal Expansion, High Thermal Conductivity

Copper Molybdenum, Copper Tungsten Heat Dissipation Material - Low Thermal Expansion, High Thermal Conductivity

High-quality copper-molybdenum and copper-tungsten heat sinks with low thermal expansion and high thermal conductivity.

Materials like Cu and Al, which are widely used in heat sinks, have high thermal expansion coefficients, leading to reliability issues in high-spec products. Planzé optimally controls the thermal expansion coefficients and thermal conductivities of copper-molybdenum and copper-tungsten at a high level to manufacture ideal heat radiators. Using advanced powder metallurgy, we achieve material properties close to your desired values.

  • Non-ferrous metals
  • Rare metals
  • Other metal materials

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Liquid Non-Silicone Thermal Interface Material "N-putty Series"

Liquid Non-Silicone Thermal Interface Material "N-putty Series"

The thermal conductivity is 1.5 to 3.0 W/m*K, making it suitable for optical products and sensitive electronic components.

The "N-putty series" is a liquid non-silicone thermal interface material made from non-silicone resin. Since there is no volatilization of low molecular siloxane, it does not lead to poor electronic circuit connections. Additionally, N700 has flexible properties with good thermal conductivity and low thermal resistance. The thermal conductivity ranges from 1.5 to 3.0 W/m*K, making it suitable for optical products and sensitive electronic components, and it is an appropriate product for automated production lines using our developed dispenser. 【Product Lineup】 ■N-putty ■N-putty2 *For more details, please download the PDF (English version) or feel free to contact us.

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[Seminar] Thermal Management and Heat Dissipation Design Addressing Both Mechanical Design and Circuit Design

[Seminar] Thermal Management and Heat Dissipation Design Addressing Both Mechanical Design and Circuit Design

Transform "thermal issues" into "design quality." Master thermal management for electronic devices from the basics to practical applications in one day!

In recent years, with the miniaturization and high performance of electronic devices, "heat" has become a critical issue that affects product performance and reliability. This seminar is aimed at hardware development designers and project managers who are troubled by issues such as "components generating more heat than expected" and "frequent failures due to heat." It will systematically explain the fundamentals of thermal design and thermal countermeasures for electronic devices, from basic principles to practical applications. We will introduce foundational knowledge such as the three principles of heat, specific countermeasures at the circuit and board levels, appropriate selection methods for thermal interface materials (TIM), and how to utilize thermal simulations, all presented in an easy-to-understand manner with a wealth of failure case studies. Take this opportunity to learn the key points of thermal design and acquire the skills to solve problems in the early stages of product development. We look forward to your participation.

  • Technical Seminar
  • Other contract services

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Thermal Interface Material (TIM)

Thermal Interface Material (TIM)

In recent years, to address the thermal challenges associated with the miniaturization and high integration of electronic devices, it has excellent thermal conductivity of 38 W/m K in the thickness direction (Z-axis).

VB200 is a thermal interface material (TIM) developed based on special elastomers to address the thermal challenges associated with the miniaturization and high integration of recent electronic devices. It has an excellent thermal conductivity of 38 W/m K in the thickness direction (Z-axis), efficiently transferring heat from the mounted electronic components. Additionally, VB200, manufactured using a special process, can provide products suitable for thin film areas where the use of liquid thermal materials is anticipated.

  • Other electronic parts

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